G06400 - SEMI G64 - 全面めっきIC用リードフレーム（金，銀，銅，ニッケル，パラジウム/ニッケル，およびパラジウム）の仕様 Revision:SEMI G64-96 (Reapproved 0811) - Superseded 4-1022 (Reapproved 0224)

4-1022 (Reapproved 0224)

These specifications cover requirements for monocrystalline silicon epitaxial layers on sapphire substrates

The assumption of wafer-to-wafer (W2W)

SEMI C23-0708 (technical revision)

注意：本基準中的正式數值皆以國際單位制（SI）表示。下列數值並非正式數值，僅供參考：

G06400 - SEMI G64 - 全面めっきIC用リードフレーム（金，銀，銅，ニッケル，パラジウム/ニッケル，およびパラジウム）の仕様 Revision:SEMI G64-96 (Reapproved 0811) - Superseded 4-1022 (Reapproved 0224)NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI Assembly & Packaging Global Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : P. P. F. SI Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit