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M06300 - SEMI M63 - 化合物半導体エピタキシャルウェーハに使用するサファイア基板の仕様 Revision:SEMI M63-0306 - Superseded SEMI MF657 — Test Method
M06300 - SEMI M63 - 化合物半導体エピタキシャルウェーハに使用するサファイア基板の仕様 Revision:SEMI M63-0306 - Superseded SEMI MF657 — Test Method
$115.50
Description
SEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Slices and Wafers by a Noncontact Scanning Method
1-0524 (technical revision)
This Specification may be applied to manufacturing process
Activation can take up to 3 business days
equipment for different substrate sizes will become simpler
M06300 - SEMI M63 - 化合物半導体エピタキシャルウェーハに使用するサファイア基板の仕様 Revision:SEMI M63-0306 - Superseded SEMI MF657 — Test Methodglobal Compound Semiconductor Materials Committee2006116global Audits and Reviews Subcommittee20062www. semi. org20063CD ROM E20068R2 2 Referenced SEMI Standards None.
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