+ 0. 5`o Wafer size: 3" dia x 0. 5 mm thickness One side Epi polished Polished surface: Wafer surface is EPI polished via a special CMP procedure. Ra <5A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Typical Properties: Crystal Structure: Hexagonal. a=4. 758 Angstroms c=12. 99 Angstroms Melting Point: 2040 degree C Density: 3. 97 gram cm2 Growth"> + 0. 5`o Wafer size: 3" dia x 0. 5 mm thickness One side Epi polished Polished surface: Wafer surface is EPI polished via a special CMP procedure. Ra <5A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Typical Properties: Crystal Structure: Hexagonal. a=4. 758 Angstroms c=12. 99 Angstroms Melting Point: 2040 degree C Density: 3. 97 gram cm2 Growth"> + 0. 5`o Wafer size: 3" dia x 0. 5 mm thickness One side Epi polished Polished surface: Wafer surface is EPI polished via a special CMP procedure. Ra <5A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Typical Properties: Crystal Structure: Hexagonal. a=4. 758 Angstroms c=12. 99 Angstroms Melting Point: 2040 degree C Density: 3. 97 gram cm2 Growth"> Al2O3- Sapphire Wafer, M Plane (10-10) 3"Dia x 0.5 mm wafer, 1SP - ALM76D05C1 Battery Cell Tester Crystal structure: CCP – ciaindustrial.com

New Arrivals are Here-Fast Shipping from Our USA Warehouse

Al2O3- Sapphire Wafer, M Plane (10-10) 3"Dia x 0.5 mm wafer, 1SP - ALM76D05C1 Battery Cell Tester Crystal structure: CCP

$204.12

Quantity
Description

Crystal structure:   CCP

Surface finish                Both sides will be polished after deposition

The micrometer head's controllable accuracy is 10 microns

This is fixed thickness precision film applicator with four paths of 5

One 3" I

Al2O3- Sapphire Wafer, M Plane (10-10) 3"Dia x 0.5 mm wafer, 1SP - ALM76D05C1 Battery Cell Tester Crystal structure: CCPSpecifications: Orientation: M Plane, <10 10> + 0. 5`o Wafer size: 3" dia x 0. 5 mm thickness One side Epi polished Polished surface: Wafer surface is EPI polished via a special CMP procedure. Ra <5A Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Typical Properties: Crystal Structure: Hexagonal. a=4. 758 Angstroms c=12. 99 Angstroms Melting Point: 2040 degree C Density: 3. 97 gram cm2 Growth

Shipping Notes
  • Free Standard Shipping on $100+ Orders to the USA.
  • Except Preorder products are shipped in 48 hours.
  • Delivery to the USA:
  1. Standard Shipping : 3-10 business days
  • If time is of the essence, please consider selecting expedited delivery for faster service.

View More

  • Product more
  • Collection:

You may also like

recommand products

50$ Store Credit
Your message